NCP3420
PACKAGE DIMENSIONS
DFN8 3x3, 0.5P
CASE 506BJ ? 01
ISSUE O
PIN 1
REFERENCE
2X
0.10 C
2X
0.10 C
0.05 C
8X
D
TOP VIEW
DETAIL B
A
B
E
A
L1
EDGE OF PACKAGE
L
DETAIL A
OPTIONAL
CONSTRUCTION
L
DETAIL A
OPTIONAL
CONSTRUCTION
NOTES:
1. DIMENSIONS AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND 0.30
MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
MILLIMETERS
DIM MIN MAX
A 0.80 1.00
A1 0.00 0.05
A3 0.20 REF
b 0.18 0.30
D 3.00 BSC
D2 1.64 1.84
E 3.00 BSC
E2 1.35 1.55
e 0.50 BSC
K 0.20 ???
L 0.30 0.50
L1 0.00 0.03
0.05 C
NOTE 4
SIDE VIEW
(A3)
A1
C
SEATING
PLANE
SOLDERMASK DEFINED
MOUNTING FOOTPRINT
8X
L
1
D2
4
DETAIL A
EXPOSED Cu
MOLD CMPD
1.85
8X
0.35
8X
K
E2
DETAIL B
OPTIONAL
CONSTRUCTION
3.30
1.55
e
8
5
8X
b
0.10 C A B
BOTTOM VIEW
0.05 C
NOTE 3
8X
0.63
0.50
PITCH
DIMENSION: MILLIMETERS
*For additional information on our Pb ? Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
8
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